Description
Presentation
| Product Type | BGA Underfill CPU Epoxy Adhesive |
Sale package
| Pack | Blase |
| Content | BGA Underfill CPU Epoxy Adhesive |
| Product status | New |
Additional information
Wylie BGA Underfill CPU Epoxy Adhesive
for Apple iPhone
Wylie BGA Underfill CPU Epoxy Adhesive is the ideal solution for professional repairs of Apple iPhone components.
Specially designed to provide a robust and durable support, this adhesive is used to reinforce the bonds between BGA chipsets and PCB (motherboard),
reducing the risk of damage caused by mechanical shock or temperature variations. An essential product for GSM repair technicians,
ensuring performance and reliability in high-precision interventions.
Features:
High compatibility: Specially designed for Apple iPhone devices
Superior Protection: Prevents cracks and detachments in BGA and PCB components
Excellent durability: Epoxy formula provides strong adhesion and long-term durability
Precise application: Easy to use due to optimized design for detailed repairs